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Double-Sided PCB On TC350 Material 60mil 2OZ With 1.6mm Thickness And ENIG Finish

Kevin, Λαμβανόμενος και δοκιμασμένος τους πίνακες - ευχαριστώ πολύ. Αυτοί είναι τέλειοι, ακριβώς τι χρειαστήκαμε. rgds Πλούσιος

—— Πλούσιο Rickett

Ruth, Πήρα το PCB σήμερα, και είναι ακριβώς τέλειοι. Παρακαλώ μείνετε λίγη υπομονή, η επόμενη διαταγή μου έρχεται σύντομα. Καλοί σεβασμοί από το Αμβούργο Olaf

—— Olaf Kühnhold

Γεια Natalie. Ήταν τέλειο, συνδέω μερικές εικόνες για την αναφορά σας. Και σας στέλνω έπειτα 2 προγράμματα στον προϋπολογισμό. Ευχαριστώ πολύ πάλι

—— Sebastian Toplisek

Kevin, Ευχαριστίες, έγιναν τέλεια, και εργασία καλά. Όπως υπόσχεται, είναι εδώ οι συνδέσεις για το πιό πρόσφατο πρόγραμμά μου, που χρησιμοποιεί το PCBs που κατασκευάσατε για με: Με τους καλύτερους χαιρετισμούς Ντάνιελ

—— Ντάνιελ Ford

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Double-Sided PCB On TC350 Material 60mil 2OZ With 1.6mm Thickness And ENIG Finish

Double-Sided PCB On TC350 Material 60mil 2OZ With 1.6mm Thickness And ENIG Finish
Double-Sided PCB On TC350 Material 60mil 2OZ With 1.6mm Thickness And ENIG Finish

Μεγάλες Εικόνας :  Double-Sided PCB On TC350 Material 60mil 2OZ With 1.6mm Thickness And ENIG Finish

Λεπτομέρειες:
Place of Origin: CHINA
Μάρκα: Bicheng
Πιστοποίηση: UL, ISO9001, IATF16949
Πληρωμής & Αποστολής Όροι:
Minimum Order Quantity: 1PCS
Τιμή: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Λεπτομερής Περιγραφή Προϊόντος
PCB Material: TC350 Core - 1.524 mm (60mil) Layer Count: 2-layer
PCB Size: 320mm x 80 mm=1PCS, +/- 0.15mm PCB Thickness: 1.6mm
Copper Weight: 1oz (1.4 mils) inner/outer layers Surface Finish: Electroless Nickel Immersion Gold (ENIG)
Solder Mask: No Silkscreen: No
Επισημαίνω:

1.6mm Thickness Double-Sided PCB

,

TC350 Double-Sided PCB

,

2OZ Double-Sided PCB

In today's fast-paced technological landscape, the demand for high-performance printed circuit boards (PCBs) continues to soar. Our newly shipped TC350 Double-Sided PCB represents a significant advancement in PCB technology, combining robust materials, meticulous design, and rigorous quality standards.

 

Construction Details

 

Premium Base Material: TC350
At the core of this PCB is TC350, a high-quality laminate composed of PTFE, ceramic fillers, and woven glass reinforcement. This unique combination offers exceptional thermal conductivity and low insertion loss, making it perfect for applications that demand efficiency and reliability.

 

Layer Count and Dimensions
This PCB features a double-sided construction, optimizing space while ensuring maximum functionality. With dimensions of 320mm x 80mm (±0.15mm), this board is engineered for versatility across a range of devices. The finished thickness of 1.6mm strikes an ideal balance between durability and performance.

 

Trace and Hole Specifications
This PCB is designed with a minimum trace and space of 6/6 mils, ensuring fine detail in circuit layouts. With a minimum hole size of 0.3mm and no blind vias, the board maintains structural integrity while accommodating various components.

 

Copper Layers and Surface Finish
Featuring two copper layers (each 70 μm thick), this PCB offers a finished copper weight of 2 oz on the outer layers. This ensures excellent conductivity and performance. The electroless nickel immersion gold (ENIG) surface finish provides superior protection against oxidation and enhances solderability.

 

Double-Sided PCB On TC350 Material 60mil 2OZ With 1.6mm Thickness And ENIG Finish 0

 

Quanlity Assurance
Each board undergoes a 100% electrical test prior to shipment, ensuring that it meets IPC-Class-2 quality standards. This rigorous testing guarantees reliability and performance, vital for any electronic application.

 

Technical Features

 

Dielectric Performance
The TC350 laminate exhibits a dielectric constant (Dk) of 3.5 at multiple frequencies (1MHz, 1.8GHz, and 10GHz), alongside a low dissipation factor of 0.0015 at 1MHz. This performance is critical for minimizing signal loss, especially in RF applications.

 

Thermal Stability
The board’s coefficients of thermal expansion (CTE) are finely tuned: 7 ppm/°C in the x/y axes and 23 ppm/°C in the z-axis. This thermal stability is essential for maintaining performance under varying conditions, particularly in high-temperature environments.

 

Moisture Resistance
With a moisture absorption rate of just 0.05%, the TC350 PCB is designed for durability, ensuring that environmental factors do not compromise its performance.

 

Typical Properties:TC350
Property Units Value Test Merthod
1. Electrical Properties  
Dielectric Constant (may vary by thickness)      
@1 MHz 3.50 IPC TM-650 2.5.5.3
@1.8 GHz 3.50 RESONANT CAVITY
@10 GHz 3.50 IPC TM-650 2.5.5.5
Dissipation Factor      
@1 MHz 0.0015 IPC TM-650 2.5.5.3
@1.8 GHz 0.0018 RESONANT CAVITY
@10 GHz 0.0020 IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric    
TC r @ 10 GHz (-40-150°C) ppm/ºC -9 IPC TM-650 2.5.5.5
Volume Resistivity      
C96/35/90 MΩ-cm 7.4x106 IPC TM-650 2.5.17.1
E24/125 MΩ-cm 1.4x108  
Surface Resistivity      
C96/35/90 3.2x107 IPC TM-650 2.5.17.1
E24/125 4.3x108 IPC TM-650 2.5.17.1
Electrical Strength Volts/mil (kV/mm) 780 (31) IPC TM-650 2.5.6.2
Dielectric Breakdown kV 40 IPC TM-650 2.5.6
Arc Resistance sec >240 IPC TM-650 2.5.1
2.Thermal Properties  
Decomposition Temperature (Td)      
Initial °C 520 IPC TM-650 2.4.24.6
5% °C 567 IPC TM-650 2.4.24.6
T260 min >60 IPC TM-650 2.4.24.1
T288 min >60 IPC TM-650 2.4.24.1
T300 min >60 IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºC ppm/ºC 7, 7 IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC ppm/ºC 12 IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC) % 1.2 IPC TM-650 2.4.24
3. Mechanical Properties  
Peel Strength to Copper (1 oz/35 micron)      
After Thermal Stress lb/in (N/mm) 7 (1.2) IPC TM-650 2.4.8
At Elevated Temperatures (150ºC) lb/in (N/mm) 9 (1.6) IPC TM-650 2.4.8.2
After Process Solutions lb/in (N/mm) 7 (1.2) IPC TM-650 2.4.8
Young’s Modulus kpsi (MPa)   IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross) kpsi (MPa) 14/10 (97/69) IPC TM-650 2.4.4
Tensile Strength (Machine/Cross) kpsi (MPa) 11/8 (76/55) IPC TM-650 2.4.18.3
Compressive Modulus kpsi (MPa)   ASTM D-3410
Poisson’s Ratio   ASTM D-3039
4. Physical Properties  
Water Absorption % 0.05 IPC TM-650 2.6.2.1
Density, ambient 23ºC g/cm3 2.30 ASTM D792 Method A
Thermal Conductivity W/mK 0.72 ASTM D5470
Specific Heat J/gK 0.90 ASTM D5470
Flammability class V0 UL-94
NASA Outgassing, 125ºC, ≤10- 6 torr      
Total Mass Loss % 0.02 NASA SP-R-0022A
Collected Volatiles % 0.01 NASA SP-R-0022A
Water Vapor Recovered % 0.01 NASA SP-R-0022A

 

Benefits of the TC350 PCB

1. Enhanced Reliability: The combination of TC350 materials and rigorous testing ensures reduced junction temperatures and improved reliability in demanding applications.

 

2. Superior Heat Management: The high thermal conductivity of TC350 facilitates excellent heat dissipation, making it ideal for power amplifiers and other high-energy devices.

 

3. Efficient Bandwidth Utilization: With its low insertion loss and excellent dielectric properties, TC350 PCB maximizes bandwidth efficiency, crucial for RF and microwave applications.

 

4. Robust Design: The absence of blind vias and the careful design of pads and traces ensure structural integrity, enhancing the longevity of the PCB.

 

Applications

TC350 PCB is suitable for a wide array of applications, including but not limited to:

 

- Power Amplifiers: Essential for maximizing signal strength in communication devices.
 

- Filters and Couplers: Used in RF applications to manage frequency signals.
 

- Tower Mounted Amplifiers (TMA): Enhances signal quality in cellular networks.
 

- Microwave Combiners and Power Dividers: Critical for efficient signal processing in advanced communication systems.

 

Conclusion

TC350 PCB stands at the forefront of PCB technology, designed to meet the rigorous demands of modern electronics. With its advanced materials, meticulous construction, and robust testing, it is an ideal choice for engineers and designers seeking reliability and performance in high-power applications.

 

For more information or to place an order, please contact our dedicated sales team. We are committed to delivering the ideal solutions for your PCB needs.

Στοιχεία επικοινωνίας
Bicheng Electronics Technology Co., Ltd

Υπεύθυνος Επικοινωνίας: Ms. Ivy Deng

Τηλ.:: 86-755-27374946

Φαξ: 86-755-27374848

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