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6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

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6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

MOQ:	1 τεμ
τιμή:	USD9.99-99.99
Τυπική συσκευασία:	Τσάντες κενού+χαρτοκιβώτια
Περίοδος παράδοσης:	8-9 εργάσιμες ημέρες
Μέθοδος πληρωμής:	T/T
Ικανότητα εφοδιασμού:	5000pcs το μήνα

Πληροφορίες Πληροφορίες

Περιγραφή προϊόντος

Λεπτομέρειες

Τόπος καταγωγής

Μάρκα

Bicheng

Πιστοποίηση

UL, ISO9001, IATF16949

Αριθμό μοντέλου

BIC-332.V1.0

Βασικό υλικό:

RO4350B + FR-4 υψηλής Tg (S1000-2M)

Αρίθμηση στρώματος:

6 στρώσεις

Πάχος PCB:

1,3 χιλιοστά

Μέγεθος PCB:

30,55mm x 37,7mm (1 τεμάχιο) με ανοχή ±0,15mm

Μεταξιού:

Λευκό

Μάσκα συγκόλλησης:

Πράσινος

Βάρος χάλκιου:

1 oz (1,4 mils) για εσωτερικές/εξωτερικές στρώσεις

Φινίρισμα επιφάνειας:

Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)

Επισημαίνω:

6-layer hybrid PCB RO4350B

high Tg FR-4 PCB

blind vias multilayer PCB

Περιγραφή προϊόντος

6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

This 6-layer hybrid PCB combines Rogers RO4350B (high-frequency laminate) and High Tg FR-4 (S1000-2M) to optimize performance for high-frequency, mission-critical applications.

PCB Specification

Construction Parameter	Specification
Base Material	RO4350B + High Tg FR-4 (S1000-2M)
Layer Count	6-layer
Board Dimensions	30.55mm x 37.7mm (1 piece) with tolerance of ±0.15mm
Minimum Trace/Space	4 mils / 4 mils
Minimum Hole Size	0.25mm
Vias (Special Types)	Blind vias (L1-L2)
Finished Board Thickness	1.3mm
Finished Copper Weight (Inner/Outer Layers)	1oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Top Silkscreen	White
Bottom Silkscreen	White
Top Solder Mask	No
Bottom Solder Mask	Green
Quality Assurance (Electrical Testing)	100% Electrical test performed prior to shipment

Hybrid PCB Stack-up

Layer Sequence	Layer Type	Specification	Thickness
1	Copper Layer (Top)	Copper_layer_1	35 μm
2	Laminate	RO4350B	0.102mm (4mil)
3	Copper Layer	Copper_layer_2	35 μm
4	Prepreg	1080 RC63% + 7628 (43%)	0.254mm (10mil)
5	Copper Layer	Copper_layer_3	35 μm
6	Core Material	S1000-2M	0.254mm (10mil)
7	Copper Layer	Copper_layer_4	35 μm
8	Prepreg	1080 RC63% + 7628 (43%)	0.254mm (10mil)
9	Copper Layer	Copper_layer_5	35 μm
10	Core Material	S1000-2M	0.254mm (10mil)
11	Copper Layer (Bottom)	Copper_layer_6	35 μm

What is a Hybrid PCB?

A hybrid PCB (also known as a mixed-material PCB) is a specialized circuit board that integrates two or more distinct base materials in its stack-up, each selected to optimize specific performance attributes. Unlike single-material PCBs, which must compromise on certain properties, hybrid PCBs leverage the strengths of each material to address diverse design requirements.

Rogers RO4350B Material Overview

Rogers RO4350B is a proprietary laminate composed of woven glass reinforcement blended with hydrocarbon/ceramic compounds, striking a balance between PTFE/woven glass-like electrical performance and the manufacturing simplicity of epoxy/glass materials.

Tailored for high-frequency applications, RO4350B laminates offer tightly controlled dielectric constant (Dk) and maintain ultra-low signal loss--all while being processable using standard epoxy/glass manufacturing workflows. A cost-effective alternative to traditional microwave laminates, RO4350B eliminates the need for specialized through-hole treatments or handling procedures required by PTFE-based materials. It also holds a UL 94 V-0 flammability rating, making it suitable for active electronic devices and high-power RF designs.

RO4350B Properties

Property	Specification
Material Type	Proprietary woven glass reinforced hydrocarbon/ceramic laminate
Dielectric Constant (Dk)	3.48 ±0.05 (measured at 10GHz/23°C)
Dissipation Factor (Df)	0.0037 (measured at 10GHz/23°C)
Thermal Conductivity	0.69 W/m/°K
Coefficient of Thermal Expansion (CTE)	X-axis: 10 ppm/°C Y-axis: 12 ppm/°C Z-axis: 32 ppm/°C
Glass Transition Temperature (Tg)	>280°C (536°F)
Moisture Absorption	0.06% (max)
Flammability Rating	UL 94 V-0

Core Features (S1000-2M High Tg FR-4)

Reduced Z-axis CTE, enhancing through-hole reliability in demanding environments
Superior mechanical processability paired with exceptional thermal resistance
Lead-free soldering compatibility, aligning with modern manufacturing standards
Glass Transition Temperature (Tg): 180°C (per DSC testing); UV-blocking properties for AOI compatibility
Outstanding high-heat endurance for stable performance in elevated temperature conditions
Excellent Anti-CAF (Conductive Anodic Filtration) performance, mitigating long-term reliability risks
Minimal moisture absorption, ensuring durability in humid operating environments

Typical Applications

Commercial Airline Broadband Antennas
Microstrip and Stripline Circuits
Millimeter Wave Systems
Radar & Guidance Systems
Point-to-Point Digital Radio Antennas

Ετικέτες:

προϊόντα

MOQ:	1 τεμ
τιμή:	USD9.99-99.99
Τυπική συσκευασία:	Τσάντες κενού+χαρτοκιβώτια
Περίοδος παράδοσης:	8-9 εργάσιμες ημέρες
Μέθοδος πληρωμής:	T/T
Ικανότητα εφοδιασμού:	5000pcs το μήνα

Λεπτομέρειες

Περιγραφή προϊόντος

Λεπτομέρειες

Τόπος καταγωγής

Κίνα

Μάρκα

Bicheng

Πιστοποίηση

UL, ISO9001, IATF16949

Αριθμό μοντέλου

BIC-332.V1.0

Βασικό υλικό:

RO4350B + FR-4 υψηλής Tg (S1000-2M)

Αρίθμηση στρώματος:

6 στρώσεις

Πάχος PCB:

1,3 χιλιοστά

Μέγεθος PCB:

30,55mm x 37,7mm (1 τεμάχιο) με ανοχή ±0,15mm

Μεταξιού:

Λευκό

Μάσκα συγκόλλησης:

Πράσινος

Βάρος χάλκιου:

1 oz (1,4 mils) για εσωτερικές/εξωτερικές στρώσεις

Φινίρισμα επιφάνειας:

Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)

Ποσότητα παραγγελίας min:

1 τεμ

Τιμή:

USD9.99-99.99

Συσκευασία λεπτομέρειες:

Τσάντες κενού+χαρτοκιβώτια

Χρόνος παράδοσης:

8-9 εργάσιμες ημέρες

Όροι πληρωμής:

T/T

Δυνατότητα προσφοράς:

5000pcs το μήνα

Επισημαίνω

6-layer hybrid PCB RO4350B

high Tg FR-4 PCB

blind vias multilayer PCB

Περιγραφή προϊόντος

6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

This 6-layer hybrid PCB combines Rogers RO4350B (high-frequency laminate) and High Tg FR-4 (S1000-2M) to optimize performance for high-frequency, mission-critical applications.

PCB Specification

Construction Parameter	Specification
Base Material	RO4350B + High Tg FR-4 (S1000-2M)
Layer Count	6-layer
Board Dimensions	30.55mm x 37.7mm (1 piece) with tolerance of ±0.15mm
Minimum Trace/Space	4 mils / 4 mils
Minimum Hole Size	0.25mm
Vias (Special Types)	Blind vias (L1-L2)
Finished Board Thickness	1.3mm
Finished Copper Weight (Inner/Outer Layers)	1oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Top Silkscreen	White
Bottom Silkscreen	White
Top Solder Mask	No
Bottom Solder Mask	Green
Quality Assurance (Electrical Testing)	100% Electrical test performed prior to shipment

Hybrid PCB Stack-up

Layer Sequence	Layer Type	Specification	Thickness
1	Copper Layer (Top)	Copper_layer_1	35 μm
2	Laminate	RO4350B	0.102mm (4mil)
3	Copper Layer	Copper_layer_2	35 μm
4	Prepreg	1080 RC63% + 7628 (43%)	0.254mm (10mil)
5	Copper Layer	Copper_layer_3	35 μm
6	Core Material	S1000-2M	0.254mm (10mil)
7	Copper Layer	Copper_layer_4	35 μm
8	Prepreg	1080 RC63% + 7628 (43%)	0.254mm (10mil)
9	Copper Layer	Copper_layer_5	35 μm
10	Core Material	S1000-2M	0.254mm (10mil)
11	Copper Layer (Bottom)	Copper_layer_6	35 μm

What is a Hybrid PCB?

Rogers RO4350B Material Overview

RO4350B Properties

Property	Specification
Material Type	Proprietary woven glass reinforced hydrocarbon/ceramic laminate
Dielectric Constant (Dk)	3.48 ±0.05 (measured at 10GHz/23°C)
Dissipation Factor (Df)	0.0037 (measured at 10GHz/23°C)
Thermal Conductivity	0.69 W/m/°K
Coefficient of Thermal Expansion (CTE)	X-axis: 10 ppm/°C Y-axis: 12 ppm/°C Z-axis: 32 ppm/°C
Glass Transition Temperature (Tg)	>280°C (536°F)
Moisture Absorption	0.06% (max)
Flammability Rating	UL 94 V-0

Core Features (S1000-2M High Tg FR-4)

Reduced Z-axis CTE, enhancing through-hole reliability in demanding environments
Superior mechanical processability paired with exceptional thermal resistance
Lead-free soldering compatibility, aligning with modern manufacturing standards
Glass Transition Temperature (Tg): 180°C (per DSC testing); UV-blocking properties for AOI compatibility
Outstanding high-heat endurance for stable performance in elevated temperature conditions
Excellent Anti-CAF (Conductive Anodic Filtration) performance, mitigating long-term reliability risks
Minimal moisture absorption, ensuring durability in humid operating environments

Typical Applications

Commercial Airline Broadband Antennas
Microstrip and Stripline Circuits
Millimeter Wave Systems
Radar & Guidance Systems
Point-to-Point Digital Radio Antennas

Ετικέτες:

Πίνακας PCB RF

Πίνακας PCB Rogers

Πίνακας PCB PTFE

Υψηλό PCB Tg

Πολυ PCB στρώματος

Taconic PCB

Πίνακας PCB HDI

PCB υψηλής ταχύτητας

Ελεγχόμενο σύνθετη αντίσταση PCB

Εύκαμπτος πίνακας PCB

fr4 πίνακας PCB

διάτρητο PCB

PCB πυρήνων μετάλλων

6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

6-layer hybrid PCB RO4350B

high Tg FR-4 PCB

blind vias multilayer PCB

2OZ πολυ PCB στρώματος,

4 πολυστρωματικών στρώματα πινάκων κυκλωμάτων,

Πίνακας PCB RF

Πίνακας PCB Rogers

Πίνακας PCB PTFE

Υψηλό PCB Tg

Πολυ PCB στρώματος

Taconic PCB

Πίνακας PCB HDI

PCB υψηλής ταχύτητας

Ελεγχόμενο σύνθετη αντίσταση PCB

Εύκαμπτος πίνακας PCB

fr4 πίνακας PCB

διάτρητο PCB

PCB πυρήνων μετάλλων

6-layer hybrid PCB RO4350B

high Tg FR-4 PCB

blind vias multilayer PCB

2OZ πολυ PCB στρώματος,

4 πολυστρωματικών στρώματα πινάκων κυκλωμάτων,