| MOQ: | 1 τεμ |
| τιμή: | USD9.99-99.99 |
| Τυπική συσκευασία: | Σακούλες κενού + Χαρτοκιβώτια |
| Περίοδος παράδοσης: | 8-9 εργάσιμες |
| Μέθοδος πληρωμής: | T/T |
| Ικανότητα εφοδιασμού: | 5000 τμχ το μήνα |
This PCB is a 2-layer rigid board, constructed with Rogers DiClad 870 (a woven fiberglass reinforced, PTFE-based composite) as its base material, featuring an Immersion Silver surface finish. It adopts 1oz (1.4 mils) copper weight for outer layers, with a finished board thickness of 0.2mm and via plating thickness of 20 μm, ensuring stable performance and precise manufacturing for high-demand electronic applications.
PCB Specifications
| Specifications | Details |
| Base material | DiClad 870 |
| Layer count | 2-layer |
| Board dimensions | 112mm x 68mm per piece, with a tolerance of +/- 0.15mm |
| Minimum Trace/Space | 6/7 mils |
| Minimum Hole Size | 0.25mm |
| Blind vias | None |
| Finished board thickness | 0.2mm |
| Finished Cu weight | 1oz (1.4 mils) for outer layers |
| Via plating thickness | 20 μm |
| Surface finish | Immersion Silver |
| Top Silkscreen | White |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Quality control | 100% Electrical test conducted prior to shipment |
PCB Stack-up
This is a 2-layer rigid PCB with the following stack-up structure (from top to bottom):
| Stack-up Layer | Specification |
| Copper_layer_1 | 35 μm |
| DiClad 870 base material | 0.127 mm (5 mil) |
| Copper_layer_2 | 35 μm |
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Artwork Type
The artwork format supplied for the PCB manufacturing process is Gerber RS-274-X, which is the industry-standard format for PCB fabrication data.
Accepted Standard
This PCB complies with the IPC-Class-2 standard, a widely adopted industry standard for printed circuit boards. IPC-Class-2 specifies requirements for PCB quality, performance, and reliability, suitable for most commercial and industrial applications where consistent performance and moderate reliability are required.
Availability
This PCB is available worldwide. We offer reliable logistics and delivery services to ensure timely shipment to customers in different countries and regions, supporting both small-batch and large-volume orders. Whether for regional electronic enterprises, research institutions, or global tech companies, we can provide consistent supply and professional after-sales support to meet diverse market demands.
Introduction to DiClad 870 Base Material
Rogers DiClad 870 laminates are woven fiberglass reinforced, PTFE-based composites designed for use as printed circuit board substrates. Compared to other laminates in the DiClad series, DiClad 870 uses fewer plies of woven fiberglass and a higher ratio of PTFE content, which enables it to offer lower dielectric constants (Dk) and dissipation factors while maintaining a similar thickness.
Key Features of DiClad 870
| Key Features | Specifications |
| Dielectric Constant (Dk) | 2.33 at 10 GHz and 1 MHz, under 50% relative humidity (RH) |
| Dissipation Factor | 0.0013 at 10 GHz and 0.0009 at 1 MHz, under 50% RH |
| Temperature Coefficient of Dielectric Constant (TcDK) | -161 ppm/°C, ranging from -10°C to 140°C at 10 GHz |
| Arc Resistance | >180 seconds |
| Moisture Absorption | 0.02% |
| Coefficient of Thermal Expansion (CTE) | 17 ppm/°C (X-axis), 29 ppm/°C (Y-axis), 217 ppm/°C (Z-axis) |
| Copper Peel Strength | 14 lbs/in, tested at 288°C for 10 seconds |
| Flammability | UL 94-V0 grade |
Core Benefits
-Lowest moisture absorption among PTFE-based composites, ensuring stable performance in various environments
-Stable dielectric constant (Dk) over a wide frequency range, guaranteeing consistent signal transmission
-Low Dk supports wider line widths, which helps reduce insertion loss and improve signal integrity
Typical Applications
Conclusion
With its core advantages, this PCB is a reliable, high-performance solution for high-demand electronic applications. It is well-suited for professionals and entities involved in radar feed networks, base station antennas and associated components, as well as Research and Development institutions and technology enterprises producing guidance systems and digital radio antennas. Its global availability, rigorous pre-shipment electrical testing, and flexible order support effectively meet the specialized high-performance needs of regional and global electronic enterprises.
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| MOQ: | 1 τεμ |
| τιμή: | USD9.99-99.99 |
| Τυπική συσκευασία: | Σακούλες κενού + Χαρτοκιβώτια |
| Περίοδος παράδοσης: | 8-9 εργάσιμες |
| Μέθοδος πληρωμής: | T/T |
| Ικανότητα εφοδιασμού: | 5000 τμχ το μήνα |
This PCB is a 2-layer rigid board, constructed with Rogers DiClad 870 (a woven fiberglass reinforced, PTFE-based composite) as its base material, featuring an Immersion Silver surface finish. It adopts 1oz (1.4 mils) copper weight for outer layers, with a finished board thickness of 0.2mm and via plating thickness of 20 μm, ensuring stable performance and precise manufacturing for high-demand electronic applications.
PCB Specifications
| Specifications | Details |
| Base material | DiClad 870 |
| Layer count | 2-layer |
| Board dimensions | 112mm x 68mm per piece, with a tolerance of +/- 0.15mm |
| Minimum Trace/Space | 6/7 mils |
| Minimum Hole Size | 0.25mm |
| Blind vias | None |
| Finished board thickness | 0.2mm |
| Finished Cu weight | 1oz (1.4 mils) for outer layers |
| Via plating thickness | 20 μm |
| Surface finish | Immersion Silver |
| Top Silkscreen | White |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Quality control | 100% Electrical test conducted prior to shipment |
PCB Stack-up
This is a 2-layer rigid PCB with the following stack-up structure (from top to bottom):
| Stack-up Layer | Specification |
| Copper_layer_1 | 35 μm |
| DiClad 870 base material | 0.127 mm (5 mil) |
| Copper_layer_2 | 35 μm |
![]()
Artwork Type
The artwork format supplied for the PCB manufacturing process is Gerber RS-274-X, which is the industry-standard format for PCB fabrication data.
Accepted Standard
This PCB complies with the IPC-Class-2 standard, a widely adopted industry standard for printed circuit boards. IPC-Class-2 specifies requirements for PCB quality, performance, and reliability, suitable for most commercial and industrial applications where consistent performance and moderate reliability are required.
Availability
This PCB is available worldwide. We offer reliable logistics and delivery services to ensure timely shipment to customers in different countries and regions, supporting both small-batch and large-volume orders. Whether for regional electronic enterprises, research institutions, or global tech companies, we can provide consistent supply and professional after-sales support to meet diverse market demands.
Introduction to DiClad 870 Base Material
Rogers DiClad 870 laminates are woven fiberglass reinforced, PTFE-based composites designed for use as printed circuit board substrates. Compared to other laminates in the DiClad series, DiClad 870 uses fewer plies of woven fiberglass and a higher ratio of PTFE content, which enables it to offer lower dielectric constants (Dk) and dissipation factors while maintaining a similar thickness.
Key Features of DiClad 870
| Key Features | Specifications |
| Dielectric Constant (Dk) | 2.33 at 10 GHz and 1 MHz, under 50% relative humidity (RH) |
| Dissipation Factor | 0.0013 at 10 GHz and 0.0009 at 1 MHz, under 50% RH |
| Temperature Coefficient of Dielectric Constant (TcDK) | -161 ppm/°C, ranging from -10°C to 140°C at 10 GHz |
| Arc Resistance | >180 seconds |
| Moisture Absorption | 0.02% |
| Coefficient of Thermal Expansion (CTE) | 17 ppm/°C (X-axis), 29 ppm/°C (Y-axis), 217 ppm/°C (Z-axis) |
| Copper Peel Strength | 14 lbs/in, tested at 288°C for 10 seconds |
| Flammability | UL 94-V0 grade |
Core Benefits
-Lowest moisture absorption among PTFE-based composites, ensuring stable performance in various environments
-Stable dielectric constant (Dk) over a wide frequency range, guaranteeing consistent signal transmission
-Low Dk supports wider line widths, which helps reduce insertion loss and improve signal integrity
Typical Applications
Conclusion
With its core advantages, this PCB is a reliable, high-performance solution for high-demand electronic applications. It is well-suited for professionals and entities involved in radar feed networks, base station antennas and associated components, as well as Research and Development institutions and technology enterprises producing guidance systems and digital radio antennas. Its global availability, rigorous pre-shipment electrical testing, and flexible order support effectively meet the specialized high-performance needs of regional and global electronic enterprises.
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