Introducing a high-performance double-sided PCB, meticulously engineered with TMM10i material, designed for RF and microwave applications. This board is constructed to meet the rigorous demands of modern electronics, ensuring reliability and performance in various high-frequency applications.
Construction Details
This double-sided PCB is constructed using TMM10i, a high-performance thermoset polymer composite designed specifically for demanding applications. The board measures 91mm x 91mm, with a tolerance of ±0.15mm, ensuring precision in dimensions crucial for intricate designs.
- Layer Count: Double-sided
- Minimum Trace/Space: 5/5 mils, allowing for compact design layouts.
- Minimum Hole Size: 0.3mm, facilitating various component placements.
- Finished Board Thickness: 0.7mm, contributing to a lightweight design.
- Finished Copper Weight: 1 oz (1.4 mils) on outer layers, ensuring adequate current handling.
- Via Plating Thickness: 20 μm, enhancing reliability in electrical connections.
- Surface Finish: Pure gold (no nickel under gold), providing excellent conductivity and resistance to oxidation.
- Electrical Testing: 100% electrical testing is performed prior to shipment, guaranteeing product quality.
PCB Stackup
The stackup of this PCB consists of two copper layers with a Rogers TMM10i core, designed for optimal performance:
- Copper Layer 1: 35 μm
- Rogers TMM10i Core: 0.635 mm (25 mils)
- Copper Layer 2: 35 μm
Quality Assurance
Quality is paramount in PCB manufacturing. Our PCBs are produced in accordance with IPC-Class-2 standards, ensuring they meet industry benchmarks for reliability and performance. Each unit undergoes rigorous electrical testing to verify functionality before shipment, minimizing the risk of defects and ensuring customer satisfaction.
| TMM10i Typical Value |
| Property |
TMM10i |
Direction |
Units |
Condition |
Test Method |
| Dielectric Constant,εProcess |
9.80±0.245 |
Z |
|
10 GHz |
IPC-TM-650 2.5.5.5 |
| Dielectric Constant,εDesign |
9.9 |
- |
- |
8GHz to 40 GHz |
Differential Phase Length Method |
| Dissipation Factor (process) |
0.002 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of dielectric constant |
-43 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
| Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
| Volume Resistivity |
2 x 108 |
- |
Mohm.cm |
- |
ASTM D257 |
| Surface Resistivity |
4 x 107 |
- |
Mohm |
- |
ASTM D257 |
| Electrical Strength(dielectric strength) |
267 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
| Thermal Properties |
| Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
| Coefficient of Thermal Expansion - x |
19 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
| Coefficient of Thermal Expansion - Y |
19 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
| Coefficient of Thermal Expansion - Z |
20 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
| Thermal Conductivity |
0.76 |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
| Mechanical Properties |
| Copper Peel Strength after Thermal Stress |
5.0 (0.9) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
| Flexural Strength (MD/CMD) |
- |
X,Y |
kpsi |
A |
ASTM D790 |
| Flexural Modulus (MD/CMD) |
1.8 |
X,Y |
Mpsi |
A |
ASTM D790 |
| Physical Properties |
| Moisture Absorption (2X2) |
1.27mm (0.050") |
0.16 |
- |
% |
D/24/23 |
ASTM D570 |
| 3.18mm (0.125") |
0.13 |
| Specific Gravity |
2.77 |
- |
- |
A |
ASTM D792 |
| Specific Heat Capacity |
0.72 |
- |
J/g/K |
A |
Calculated |
| Lead-Free Process Compatible |
YES |
- |
- |
- |
- |
Material Features
TMM10i Characteristics
Rogers TMM10i material is known for its excellent electrical performance, making it ideal for high-frequency applications. Key characteristics include:
- Dielectric Constant (Dk): 9.80 ± 0.245
- Dissipation Factor: 0.0020 at 10 GHz, minimizing signal loss.
- Thermal Coefficient of Dk: -43 ppm/°K, ensuring stability across varying temperatures.
- Decomposition Temperature (Td): 425 °C (TGA), providing thermal resilience.
- Thermal Conductivity: 0.76 W/mK, facilitating effective heat dissipation.
Benefits of TMM10i Material
The use of TMM10i offers several advantages:
- Mechanical Stability: The material's properties resist creep and cold flow, ensuring structural integrity over time.
- Chemical Resistance: Its resistance to process chemicals minimizes damage during fabrication, enhancing durability.
- Simplified Processing: No sodium naphthanate treatment is required prior to electroless plating, streamlining manufacturing processes.
- Reliable Wire-Bonding: Based on a thermoset resin, TMM10i supports dependable wire-bonding applications.
Typical Applications
The versatility of this double-sided PCB makes it suitable for a wide range of applications, including:
- RF and Microwave Circuitry: Ideal for amplifiers, filters, and couplers.
- Satellite Communication Systems: Designed to withstand the rigors of space applications.
- Global Positioning Systems Antennas: Optimized for precise navigation.
- Patch Antennas and Dielectric Polarizers: Effective for signal transmission and reception.
- Chip Testers: Reliable performance in testing environments.
Availability
This high-performance PCB is available worldwide, ensuring accessibility for customers seeking advanced solutions for their electronic designs.
Conclusion
This double-sided PCB, made from TMM10i material, represents an exceptional combination of reliability, performance, and versatility. With its advanced specifications and high-quality construction, it is perfectly suited for a wide range of demanding applications within the electronics industry. By selecting our PCB, customers can be confident that their projects will leverage cutting-edge technology and proven reliability. Elevate your designs today with our state-of-the-art PCB solutions.
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