| MOQ: | 1 τεμ |
| τιμή: | USD9.99-99.99 |
| Τυπική συσκευασία: | Τσάντες κενού+χαρτοκιβώτια |
| Περίοδος παράδοσης: | 8-9 εργάσιμες ημέρες |
| Μέθοδος πληρωμής: | T/T |
| Ικανότητα εφοδιασμού: | 5000pcs το μήνα |
| Parameter | Details |
|---|---|
| Base Material | Rogers RT/duroid 6010.2LM (ceramic-PTFE composite core) |
| Layer Count | 2-Layer rigid PCB |
| Board Dimensions | 45.4mm x 31.8mm (1 piece)±0.15mm |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.3mm |
| Via Type | No blind vias (thru-hole vias only) |
| Finished Board Thickness | 2.0mm |
| Finished Copper Weight (Outer Layers) | 1oz (equivalent to 1.4 mils / 35 μm per layer) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Silver (enhances conductivity, ensures reliable soldering) |
| Silkscreen | Top: White; Bottom: No |
| Solder Mask | Top: No; Bottom: No |
| Quality Assurance | 100% Electrical test prior to shipment |
| Layer Type | Material/Description | Thickness |
|---|---|---|
| Copper Layer 1 (Outer) | Conductive copper (finished) | 35 μm (1oz) |
| Dielectric Core | Rogers RT/duroid 6010.2LM | 1.905 mm (75 mils) |
| Copper Layer 2 (Outer) | Conductive copper (finished) | 35 μm (1oz) |
| Specification | Value |
|---|---|
| Material Type | Ceramic-PTFE composite |
| Dielectric Constant (Dk) | 10.2 ± 0.25 at 10 GHz |
| Dissipation Factor (tanδ) | 0.0023 at 10 GHz |
| Decomposition Temperature (Td, TGA) | 500 °C |
| Moisture Absorption | 0.01% |
| Coefficient of Thermal Expansion (CTE) | X-axis: 24 ppm/°C; Y-axis: 24 ppm/°C; Z-axis: 47 ppm/°C |
| Thermal Conductivity | 0.86 W/mK |
| Flammability Rating | UL 94 V-0 |
| MOQ: | 1 τεμ |
| τιμή: | USD9.99-99.99 |
| Τυπική συσκευασία: | Τσάντες κενού+χαρτοκιβώτια |
| Περίοδος παράδοσης: | 8-9 εργάσιμες ημέρες |
| Μέθοδος πληρωμής: | T/T |
| Ικανότητα εφοδιασμού: | 5000pcs το μήνα |
| Parameter | Details |
|---|---|
| Base Material | Rogers RT/duroid 6010.2LM (ceramic-PTFE composite core) |
| Layer Count | 2-Layer rigid PCB |
| Board Dimensions | 45.4mm x 31.8mm (1 piece)±0.15mm |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.3mm |
| Via Type | No blind vias (thru-hole vias only) |
| Finished Board Thickness | 2.0mm |
| Finished Copper Weight (Outer Layers) | 1oz (equivalent to 1.4 mils / 35 μm per layer) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Silver (enhances conductivity, ensures reliable soldering) |
| Silkscreen | Top: White; Bottom: No |
| Solder Mask | Top: No; Bottom: No |
| Quality Assurance | 100% Electrical test prior to shipment |
| Layer Type | Material/Description | Thickness |
|---|---|---|
| Copper Layer 1 (Outer) | Conductive copper (finished) | 35 μm (1oz) |
| Dielectric Core | Rogers RT/duroid 6010.2LM | 1.905 mm (75 mils) |
| Copper Layer 2 (Outer) | Conductive copper (finished) | 35 μm (1oz) |
| Specification | Value |
|---|---|
| Material Type | Ceramic-PTFE composite |
| Dielectric Constant (Dk) | 10.2 ± 0.25 at 10 GHz |
| Dissipation Factor (tanδ) | 0.0023 at 10 GHz |
| Decomposition Temperature (Td, TGA) | 500 °C |
| Moisture Absorption | 0.01% |
| Coefficient of Thermal Expansion (CTE) | X-axis: 24 ppm/°C; Y-axis: 24 ppm/°C; Z-axis: 47 ppm/°C |
| Thermal Conductivity | 0.86 W/mK |
| Flammability Rating | UL 94 V-0 |