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LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
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LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
  • Ονομασία

LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish

MOQ: 1 τεμ
τιμή: USD9.99-99.99
Τυπική συσκευασία: Τσάντες κενού+χαρτοκιβώτια
Περίοδος παράδοσης: 8-9 εργάσιμες ημέρες
Μέθοδος πληρωμής: T/T
Ικανότητα εφοδιασμού: 5000pcs το μήνα
Πληροφορίες Πληροφορίες
Περιγραφή προϊόντος
Λεπτομέρειες
Τόπος καταγωγής
Κίνα
Μάρκα
Bicheng
Πιστοποίηση
UL, ISO9001, IATF16949
Αριθμό μοντέλου
BIC-332.V1.0
Βασικό υλικό:
Rogers RO4350B Low Profile (LoPro)
Αρίθμηση στρώματος:
2 στρώματα
Πάχος PCB:
1,6 mm
Μέγεθος PCB:
43mm x 56mm ανά τεμάχιο (1 τεμ.)
Μεταξιού:
Λευκό
Μάσκα συγκόλλησης:
Πράσινος
Βάρος χάλκιου:
1 oz (1,4 mils) για τα εξωτερικά στρώματα
Φινίρισμα επιφάνειας:
ENEPIG (ηλεκτροχωρίς νικέλιο ηλεκτρικό παλλάδιο και χρυσός εμβάπτισης)
Επισημαίνω:

LoPro RO4350B PCB board

,

Double-sided Rogers PCB 1.6mm

,

ENEPIG finish PCB board

Περιγραφή προϊόντος
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
This 2-layer rigid PCB is engineered for high-frequency RF and high-speed digital applications, leveraging Rogers RO4350B Low Profile (LoPro) material--a hydrocarbon ceramic laminate with proprietary reverse-treated foil technology. To achieve superior signal integrity, reduced conductor loss, and cost-efficient manufacturing, it balances performance and practicality for use cases ranging from cellular base stations to high-speed servers.
PCB Specification
Parameter Details
Base Material Rogers RO4350B Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count 2-Layer (rigid structure)
Board Dimensions 43mm x 56mm per piece (1PCS)
Minimum Trace/Space 4 mils (trace) / 6 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; via plating thickness = 20 μm
Finished Board Thickness 1.6mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish ENEPIG (Electroless Nickel Electroless Palladium and Immersion Gold)
Silkscreen White silkscreen on top layer; no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing before shipment
PCB Stack-up
Layer Name Material Thickness
Top Layer (Copper_layer_1) 35 μm thick copper 35 μm (1oz)
Substrate Layer Rogers RO4350B LoPro 1.542mm (60.7mil)
Bottom Layer (Copper_layer_2) 35 μm thick copper 35 μm (1oz)
Rogers RO4350B Low Profile Material
Rogers RO4350B LoPro redefines cost-effective high-frequency design with its proprietary reverse-treated foil technology. This innovation bonds foil directly to standard RO4350B dielectric, delivering reduced conductor loss (and thus improved insertion loss) while retaining all key benefits of standard RO4350B:
FR-4 Process Compatibility: No specialized via preparation (e.g., sodium etch) required - uses standard epoxy/glass fabrication workflows to lower manufacturing costs and lead times.
Hydrocarbon Ceramic Composition: Combines low dielectric loss with mechanical stability, making it ideal for mixed-signal (RF + digital) applications.
Environmental Compliance: Lead-free process compatible and UL 94-V0 rated, meeting global safety and sustainability standards.
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish 0
Key Material Features
Feature Specification
Dielectric Constant (Dk) 3.48 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF) 0.0037 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >390°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.69 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 10 ppm/°C
- Y-axis: 12 ppm/°C
- Z-axis: 32 ppm/°C (-55 to 288°C)
Flammability Rating UL 94-V0
Additional Attributes CAF (Conductive Anodic Filament) resistant; lead-free compatible
Core Benefits
  • Ultra-Low Insertion Loss: Enables reliable operation beyond 40 GHz - critical for high-frequency applications like LNBs and base station antennas.
  • Reduced PIM: Minimizes passive intermodulation for clear signal transmission in cellular infrastructure, avoiding call drops or data degradation.
  • Thermal Resilience: Lower conductor loss improves heat dissipation, while high Tg/Td withstands lead-free soldering and high-temperature operating environments (e.g., server racks, outdoor antennas).
  • Copper-Matched CTE: X/Y-axis CTE (10/12 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling - ensuring long-term reliability.
  • Design Flexibility: Supports multi-layer scalability (for future complex designs) and 2-layer cost-effectiveness, with CAF resistance for durability in humid environments.
Some Typical Applications
  • Digital applications such as servers, routers, and high speed back planes
  • Cellular base station antennas and power amplifiers
  • LNB's for direct broadcast satellites
  • RF Identification Tags
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish 1
Summary
The 2-layer PCB with Rogers RO4350B Low Profile material is a versatile, high-performance solution for RF and high-speed digital applications. By combining low conductor loss, FR-4 compatibility, ENEPIG finish, and industry-leading reliability, it addresses the key challenges of modern electronics - from signal integrity at 40+ GHz to cost-effective volume manufacturing. Its global availability and compliance with IPC-Class-2 standards make it a trusted choice for telecom, data center, satellite, and RFID projects worldwide.
Ετικέτες: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

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προϊόντα
λεπτομέρειες για τα προϊόντα
προϊόντα

Πίνακας PCB RF

Πίνακας PCB Rogers

Πίνακας PCB PTFE

Υψηλό PCB Tg

Πολυ PCB στρώματος

Taconic PCB

Πίνακας PCB HDI

PCB υψηλής ταχύτητας

Ελεγχόμενο σύνθετη αντίσταση PCB

Εύκαμπτος πίνακας PCB

fr4 πίνακας PCB

διάτρητο PCB

PCB πυρήνων μετάλλων
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
  • Ονομασία
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
MOQ: 1 τεμ
τιμή: USD9.99-99.99
Τυπική συσκευασία: Τσάντες κενού+χαρτοκιβώτια
Περίοδος παράδοσης: 8-9 εργάσιμες ημέρες
Μέθοδος πληρωμής: T/T
Ικανότητα εφοδιασμού: 5000pcs το μήνα
Λεπτομέρειες
Περιγραφή προϊόντος
Λεπτομέρειες
Τόπος καταγωγής
Κίνα
Μάρκα
Bicheng
Πιστοποίηση
UL, ISO9001, IATF16949
Αριθμό μοντέλου
BIC-332.V1.0
Βασικό υλικό:
Rogers RO4350B Low Profile (LoPro)
Αρίθμηση στρώματος:
2 στρώματα
Πάχος PCB:
1,6 mm
Μέγεθος PCB:
43mm x 56mm ανά τεμάχιο (1 τεμ.)
Μεταξιού:
Λευκό
Μάσκα συγκόλλησης:
Πράσινος
Βάρος χάλκιου:
1 oz (1,4 mils) για τα εξωτερικά στρώματα
Φινίρισμα επιφάνειας:
ENEPIG (ηλεκτροχωρίς νικέλιο ηλεκτρικό παλλάδιο και χρυσός εμβάπτισης)
Ποσότητα παραγγελίας min:
1 τεμ
Τιμή:
USD9.99-99.99
Συσκευασία λεπτομέρειες:
Τσάντες κενού+χαρτοκιβώτια
Χρόνος παράδοσης:
8-9 εργάσιμες ημέρες
Όροι πληρωμής:
T/T
Δυνατότητα προσφοράς:
5000pcs το μήνα
Επισημαίνω

LoPro RO4350B PCB board

,

Double-sided Rogers PCB 1.6mm

,

ENEPIG finish PCB board

Περιγραφή προϊόντος
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
This 2-layer rigid PCB is engineered for high-frequency RF and high-speed digital applications, leveraging Rogers RO4350B Low Profile (LoPro) material--a hydrocarbon ceramic laminate with proprietary reverse-treated foil technology. To achieve superior signal integrity, reduced conductor loss, and cost-efficient manufacturing, it balances performance and practicality for use cases ranging from cellular base stations to high-speed servers.
PCB Specification
Parameter Details
Base Material Rogers RO4350B Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count 2-Layer (rigid structure)
Board Dimensions 43mm x 56mm per piece (1PCS)
Minimum Trace/Space 4 mils (trace) / 6 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; via plating thickness = 20 μm
Finished Board Thickness 1.6mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish ENEPIG (Electroless Nickel Electroless Palladium and Immersion Gold)
Silkscreen White silkscreen on top layer; no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing before shipment
PCB Stack-up
Layer Name Material Thickness
Top Layer (Copper_layer_1) 35 μm thick copper 35 μm (1oz)
Substrate Layer Rogers RO4350B LoPro 1.542mm (60.7mil)
Bottom Layer (Copper_layer_2) 35 μm thick copper 35 μm (1oz)
Rogers RO4350B Low Profile Material
Rogers RO4350B LoPro redefines cost-effective high-frequency design with its proprietary reverse-treated foil technology. This innovation bonds foil directly to standard RO4350B dielectric, delivering reduced conductor loss (and thus improved insertion loss) while retaining all key benefits of standard RO4350B:
FR-4 Process Compatibility: No specialized via preparation (e.g., sodium etch) required - uses standard epoxy/glass fabrication workflows to lower manufacturing costs and lead times.
Hydrocarbon Ceramic Composition: Combines low dielectric loss with mechanical stability, making it ideal for mixed-signal (RF + digital) applications.
Environmental Compliance: Lead-free process compatible and UL 94-V0 rated, meeting global safety and sustainability standards.
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish 0
Key Material Features
Feature Specification
Dielectric Constant (Dk) 3.48 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF) 0.0037 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >390°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.69 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 10 ppm/°C
- Y-axis: 12 ppm/°C
- Z-axis: 32 ppm/°C (-55 to 288°C)
Flammability Rating UL 94-V0
Additional Attributes CAF (Conductive Anodic Filament) resistant; lead-free compatible
Core Benefits
  • Ultra-Low Insertion Loss: Enables reliable operation beyond 40 GHz - critical for high-frequency applications like LNBs and base station antennas.
  • Reduced PIM: Minimizes passive intermodulation for clear signal transmission in cellular infrastructure, avoiding call drops or data degradation.
  • Thermal Resilience: Lower conductor loss improves heat dissipation, while high Tg/Td withstands lead-free soldering and high-temperature operating environments (e.g., server racks, outdoor antennas).
  • Copper-Matched CTE: X/Y-axis CTE (10/12 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling - ensuring long-term reliability.
  • Design Flexibility: Supports multi-layer scalability (for future complex designs) and 2-layer cost-effectiveness, with CAF resistance for durability in humid environments.
Some Typical Applications
  • Digital applications such as servers, routers, and high speed back planes
  • Cellular base station antennas and power amplifiers
  • LNB's for direct broadcast satellites
  • RF Identification Tags
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish 1
Summary
The 2-layer PCB with Rogers RO4350B Low Profile material is a versatile, high-performance solution for RF and high-speed digital applications. By combining low conductor loss, FR-4 compatibility, ENEPIG finish, and industry-leading reliability, it addresses the key challenges of modern electronics - from signal integrity at 40+ GHz to cost-effective volume manufacturing. Its global availability and compliance with IPC-Class-2 standards make it a trusted choice for telecom, data center, satellite, and RFID projects worldwide.
Ετικέτες: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan, Fuyong, Baoan, Shenzhen, Guangdong, Κίνα 518103
Το τηλεφώνημα: 86-755-27374946
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