| MOQ: | 1 τεμ |
| τιμή: | USD9.99-99.99 |
| Τυπική συσκευασία: | Τσάντες κενού+χαρτοκιβώτια |
| Περίοδος παράδοσης: | 8-9 εργάσιμες ημέρες |
| Μέθοδος πληρωμής: | T/T |
| Ικανότητα εφοδιασμού: | 5000pcs το μήνα |
| Parameter | Specification |
|---|---|
| Layer Count | 2-layer rigid PCB |
| Base Material | Rogers RO3010 (ceramic-filled PTFE composite) |
| Board Dimensions | 45mm x 65mm (1 piece) |
| Finished Board Thickness | 0.8mm |
| Finished Copper Weight (Outer Layers) | 1oz (1.4 mils / 35μm) |
| Via Plating Thickness | 20μm |
| Minimum Trace/Space | 4 mils / 4 mils |
| Minimum Hole Size | 0.3mm |
| Vias | 12 total (no blind vias) |
| Surface Finish | Immersion Gold |
| Silkscreen | Top: Black; Bottom: No |
| Solder Mask | Top: No; Bottom: No |
| Quality Assurance | 100% Electrical test prior to shipment |
| Layer Sequence | Layer Type | Specification | Thickness |
|---|---|---|---|
| 1 | Copper Layer (Top - L1) | Copper_layer_1 | 35μm (1oz) |
| 2 | Substrate | Rogers RO3010 | 0.635mm (25mil) |
| 3 | Copper Layer (Bottom - L2) | Copper_layer_2 | 35μm (1oz) |
| Property | Specification |
|---|---|
| Dielectric Constant (Dk) | 10.2 ±0.30 (10GHz/23°C) |
| Dissipation Factor (Df) | 0.0022 (10GHz/23°C) |
| Coefficient of Thermal Expansion (CTE) | X-axis: 13 ppm/°C; Y-axis: 11 ppm/°C; Z-axis: 16 ppm/°C (-55°C to 288°C) |
| Thermal Decomposition Temperature (Td) | >500°C |
| Thermal Conductivity | 0.95 W/mK |
| Moisture Absorption | 0.05% |
| Operating Temperature Range | -40°C to +85°C |
| Quality Certification | ISO 9001 Certified |
| MOQ: | 1 τεμ |
| τιμή: | USD9.99-99.99 |
| Τυπική συσκευασία: | Τσάντες κενού+χαρτοκιβώτια |
| Περίοδος παράδοσης: | 8-9 εργάσιμες ημέρες |
| Μέθοδος πληρωμής: | T/T |
| Ικανότητα εφοδιασμού: | 5000pcs το μήνα |
| Parameter | Specification |
|---|---|
| Layer Count | 2-layer rigid PCB |
| Base Material | Rogers RO3010 (ceramic-filled PTFE composite) |
| Board Dimensions | 45mm x 65mm (1 piece) |
| Finished Board Thickness | 0.8mm |
| Finished Copper Weight (Outer Layers) | 1oz (1.4 mils / 35μm) |
| Via Plating Thickness | 20μm |
| Minimum Trace/Space | 4 mils / 4 mils |
| Minimum Hole Size | 0.3mm |
| Vias | 12 total (no blind vias) |
| Surface Finish | Immersion Gold |
| Silkscreen | Top: Black; Bottom: No |
| Solder Mask | Top: No; Bottom: No |
| Quality Assurance | 100% Electrical test prior to shipment |
| Layer Sequence | Layer Type | Specification | Thickness |
|---|---|---|---|
| 1 | Copper Layer (Top - L1) | Copper_layer_1 | 35μm (1oz) |
| 2 | Substrate | Rogers RO3010 | 0.635mm (25mil) |
| 3 | Copper Layer (Bottom - L2) | Copper_layer_2 | 35μm (1oz) |
| Property | Specification |
|---|---|
| Dielectric Constant (Dk) | 10.2 ±0.30 (10GHz/23°C) |
| Dissipation Factor (Df) | 0.0022 (10GHz/23°C) |
| Coefficient of Thermal Expansion (CTE) | X-axis: 13 ppm/°C; Y-axis: 11 ppm/°C; Z-axis: 16 ppm/°C (-55°C to 288°C) |
| Thermal Decomposition Temperature (Td) | >500°C |
| Thermal Conductivity | 0.95 W/mK |
| Moisture Absorption | 0.05% |
| Operating Temperature Range | -40°C to +85°C |
| Quality Certification | ISO 9001 Certified |