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PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

MOQ: 1 τεμ
τιμή: USD9.99-99.99
Τυπική συσκευασία: Σακούλες κενού + Χαρτοκιβώτια
Περίοδος παράδοσης: 8-9 εργάσιμες
Μέθοδος πληρωμής: T/T
Ικανότητα εφοδιασμού: 5000 τμχ το μήνα
Λεπτομέρειες
Τόπος καταγωγής
Κίνα
Μάρκα
Bicheng
Πιστοποίηση
UL, ISO9001, IATF16949
Αριθμό μοντέλου
BIC-332.V1.0
Αριθμός ανταλλακτικού:
Tly-3
Πάχος laminate:
0,0035 ίντσες; 0,0050 ίντσες; 0,0075 ίντσες; 0,0100 ίντσες
Μέγεθος laminate:
12 x 18 ίντσες (305 x 457 mm); 16 x 36 ίντσες (406 x 914 mm); 16 x 18 ίντσες (406 x 457 mm); 24 x 36
Βάρος χαλκού:
1/2 ουγκιά. ED χαλκός · 1 oz. CL1 χαλκός · 1 ουγκιά. C1 coppe
Επισημαίνω:

PCB material TLY-3 laminate

,

high frequency copper clad sheet

,

TLY-3 copper clad laminate

Περιγραφή προϊόντος

TLY-3 laminates are fabricated using ultra-lightweight woven fiberglass, offering significantly greater dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiberglass matrix delivers a mechanically robust laminate ideal for high-volume production. Featuring an extremely low dissipation factor, TLY-3 performs reliably in 77 GHz automotive radar systems and other millimeter-wave antenna designs.

 

Comparative OEM testing at 77 GHz between low-reinforcement TLY-3 and its nearest chopped fiber-reinforced competitor demonstrated comparable “drop-in” insertion loss and dielectric performance, with the key advantage of drastically improved manufacturing yields. The dielectric constant (Dk) ranges from 2.17 to 2.40. For most thicknesses, Dk can be specified at any value within this range with a tight tolerance of ±0.02. At 10 GHz, the typical dissipation factor (Df) in the low-Dk region is approximately 0.0009.

 

Typical applications include satellite communications, automotive radar, filters, couplers, avionics, and phased-array antennas.

 

PCB Material TLY-3  High Frequency Laminates Copper Clad Sheet 0

 

Properties Conditions Typical Value Unit Test Method

Electrical Properties

 

Dielectric Constant @ 10 GHz 2.33 ± 0.02 - IPC-650 2.5.5.5
Dissipation Factor @ 10 GHz 0.0012 - IPC-650 2.5.5.5
Volume Resistivity (after elevated temp.) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Volume Resistivity (after humidity) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Surface Resistivity (after elevated temp.) 10⁸ Mohms IPC-650 2.5.17.1
Surface Resistivity (after humidity) 10⁸ Mohms IPC-650 2.5.17.1
Thermal Properties Thermal Conductivity 0.22 W/M*K ASTM F 433
CTE (25-260°C) - X 26 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Y 15 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Z 217 ppm/°C ASTM D 3386 (TMA)
Mechanical Properties Peel Strength - 1/2 oz. ED copper 1.96 (11) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. CL1 copper 2.86 (16) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. C1 copper 3.04 (17) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength (at elevated temp.) 2.32 (13) N/mm (Ibs/in) IPC-650 2.4.8
Flexural Strength - MD 96.91 (14,057) N/mm² (psi) IPC-650 2.4.4
Flexural Strength - CD 89.32 (12,955) N/mm² (psi) IPC-650 2.4.4
Young’s Modulus - MD 9.65 X 10³ (1.4 X 10⁶) N/mm² (psi) ASTM D 3039 / IPC-650 2.4.19
Poisson’s Ratio - MD 0.21 - ASTM D 3039 / IPC-650 2.4.19
Mechanical Properties Density Specific Gravity 2.19 g/cm³ ASTM D 792
Mechanical Properties Dimensional Stability - MD, 10 mil -0.038 mm/M (mils/in) IPC-650 2.4.39
Mechanical Properties Dimensional Stability - CD, 10 mil (avg. after bake & thermal stress) -0.038 mm/M (mils/in) -
Chemical / Physical Properties Moisture Absorption 0.02 % IPC-650 2.6.2.1
NASA Outgassing - TML 0.01 % -
NASA Outgassing - CVCM 0.01 % -
NASA Outgassing - WVR 0.01 % -
UL-94 Flammability Rating V-0 - UL-94

 

Key Benefits

  • Excellent dimensional stability
  • Ultra-low dissipation factor (Df)
  • High peel strength
  • Low moisture absorption
  • Consistent, uniform dielectric constant (Dk)
  • Laser-ablatable

 

Target Applications

  • Automotive radar
  • Satellite and cellular communications
  • Power amplifiers
  • LNBs, LNAs, and LNCs
  • Aerospace systems
  • Ka-band, E-band, and W-band applications
προϊόντα
λεπτομέρειες για τα προϊόντα
PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet
MOQ: 1 τεμ
τιμή: USD9.99-99.99
Τυπική συσκευασία: Σακούλες κενού + Χαρτοκιβώτια
Περίοδος παράδοσης: 8-9 εργάσιμες
Μέθοδος πληρωμής: T/T
Ικανότητα εφοδιασμού: 5000 τμχ το μήνα
Λεπτομέρειες
Τόπος καταγωγής
Κίνα
Μάρκα
Bicheng
Πιστοποίηση
UL, ISO9001, IATF16949
Αριθμό μοντέλου
BIC-332.V1.0
Αριθμός ανταλλακτικού:
Tly-3
Πάχος laminate:
0,0035 ίντσες; 0,0050 ίντσες; 0,0075 ίντσες; 0,0100 ίντσες
Μέγεθος laminate:
12 x 18 ίντσες (305 x 457 mm); 16 x 36 ίντσες (406 x 914 mm); 16 x 18 ίντσες (406 x 457 mm); 24 x 36
Βάρος χαλκού:
1/2 ουγκιά. ED χαλκός · 1 oz. CL1 χαλκός · 1 ουγκιά. C1 coppe
Ποσότητα παραγγελίας min:
1 τεμ
Τιμή:
USD9.99-99.99
Συσκευασία λεπτομέρειες:
Σακούλες κενού + Χαρτοκιβώτια
Χρόνος παράδοσης:
8-9 εργάσιμες
Όροι πληρωμής:
T/T
Δυνατότητα προσφοράς:
5000 τμχ το μήνα
Επισημαίνω

PCB material TLY-3 laminate

,

high frequency copper clad sheet

,

TLY-3 copper clad laminate

Περιγραφή προϊόντος

TLY-3 laminates are fabricated using ultra-lightweight woven fiberglass, offering significantly greater dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiberglass matrix delivers a mechanically robust laminate ideal for high-volume production. Featuring an extremely low dissipation factor, TLY-3 performs reliably in 77 GHz automotive radar systems and other millimeter-wave antenna designs.

 

Comparative OEM testing at 77 GHz between low-reinforcement TLY-3 and its nearest chopped fiber-reinforced competitor demonstrated comparable “drop-in” insertion loss and dielectric performance, with the key advantage of drastically improved manufacturing yields. The dielectric constant (Dk) ranges from 2.17 to 2.40. For most thicknesses, Dk can be specified at any value within this range with a tight tolerance of ±0.02. At 10 GHz, the typical dissipation factor (Df) in the low-Dk region is approximately 0.0009.

 

Typical applications include satellite communications, automotive radar, filters, couplers, avionics, and phased-array antennas.

 

PCB Material TLY-3  High Frequency Laminates Copper Clad Sheet 0

 

Properties Conditions Typical Value Unit Test Method

Electrical Properties

 

Dielectric Constant @ 10 GHz 2.33 ± 0.02 - IPC-650 2.5.5.5
Dissipation Factor @ 10 GHz 0.0012 - IPC-650 2.5.5.5
Volume Resistivity (after elevated temp.) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Volume Resistivity (after humidity) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Surface Resistivity (after elevated temp.) 10⁸ Mohms IPC-650 2.5.17.1
Surface Resistivity (after humidity) 10⁸ Mohms IPC-650 2.5.17.1
Thermal Properties Thermal Conductivity 0.22 W/M*K ASTM F 433
CTE (25-260°C) - X 26 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Y 15 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Z 217 ppm/°C ASTM D 3386 (TMA)
Mechanical Properties Peel Strength - 1/2 oz. ED copper 1.96 (11) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. CL1 copper 2.86 (16) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. C1 copper 3.04 (17) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength (at elevated temp.) 2.32 (13) N/mm (Ibs/in) IPC-650 2.4.8
Flexural Strength - MD 96.91 (14,057) N/mm² (psi) IPC-650 2.4.4
Flexural Strength - CD 89.32 (12,955) N/mm² (psi) IPC-650 2.4.4
Young’s Modulus - MD 9.65 X 10³ (1.4 X 10⁶) N/mm² (psi) ASTM D 3039 / IPC-650 2.4.19
Poisson’s Ratio - MD 0.21 - ASTM D 3039 / IPC-650 2.4.19
Mechanical Properties Density Specific Gravity 2.19 g/cm³ ASTM D 792
Mechanical Properties Dimensional Stability - MD, 10 mil -0.038 mm/M (mils/in) IPC-650 2.4.39
Mechanical Properties Dimensional Stability - CD, 10 mil (avg. after bake & thermal stress) -0.038 mm/M (mils/in) -
Chemical / Physical Properties Moisture Absorption 0.02 % IPC-650 2.6.2.1
NASA Outgassing - TML 0.01 % -
NASA Outgassing - CVCM 0.01 % -
NASA Outgassing - WVR 0.01 % -
UL-94 Flammability Rating V-0 - UL-94

 

Key Benefits

  • Excellent dimensional stability
  • Ultra-low dissipation factor (Df)
  • High peel strength
  • Low moisture absorption
  • Consistent, uniform dielectric constant (Dk)
  • Laser-ablatable

 

Target Applications

  • Automotive radar
  • Satellite and cellular communications
  • Power amplifiers
  • LNBs, LNAs, and LNCs
  • Aerospace systems
  • Ka-band, E-band, and W-band applications
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