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High Frequency DiClad 870 Copper Clad Laminate Sheet

High Frequency DiClad 870 Copper Clad Laminate Sheet

MOQ: 1 τεμ
τιμή: USD9.99-99.99
Τυπική συσκευασία: Σακούλες κενού + Χαρτοκιβώτια
Περίοδος παράδοσης: 8-9 εργάσιμες
Μέθοδος πληρωμής: T/T
Ικανότητα εφοδιασμού: 5000 τμχ το μήνα
Λεπτομέρειες
Τόπος καταγωγής
Κίνα
Μάρκα
Bicheng
Πιστοποίηση
UL, ISO9001, IATF16949
Αριθμό μοντέλου
BIC-332.V1.0
Αριθμός ανταλλακτικού:
Diclad 870
Πάχος laminate:
0,127mm 0,254mm 0,508mm 0,787mm 2,362mm 3,175mm
Μέγεθος laminate:
8” X 12” (203 X 305 mm)· 18” X 24” (475 X 610 mm)
Βάρος χαλκού:
0,5 OZ (0,018 mm), 1 OZ (0,035 mm)
Επισημαίνω:

High Frequency DiClad 870 laminate

,

Copper clad laminate sheet

,

DiClad 870 copper laminate

Περιγραφή προϊόντος

DiClad 870 laminates are woven fiberglass-reinforced PTFE composite materials formulated specifically for deployment as printed circuit board (PCB) substrates. Through precise regulation of the fiberglass-to-PTFE ratio, DiClad 870 laminates deliver a diversified product portfolio—spanning variants with ultra-low dielectric constant (Dk) and dissipation factor (Df), to highly reinforced grades optimized for enhanced dimensional stability.


The woven fiberglass reinforcement inherent to DiClad series materials confers superior dimensional stability compared to nonwoven fiberglass-reinforced PTFE laminates of equivalent dielectric constant. Rogers’ stringent consistency and process control over PTFE-coated fiberglass cloth not only enables a broader spectrum of available Dk values, but also yields laminates with improved dielectric constant uniformity relative to comparable nonwoven fiberglass-reinforced alternatives. The coated fiberglass plies within DiClad 870 materials are unidirectionally aligned; cross-plied configurations of most grades are offered under the CuClad product line.


DiClad 870 laminates are ideally suited for applications where dielectric constant uniformity is a critical performance criterion, including RF filters, couplers, and low-noise amplifiers (LNAs). They are also well-positioned for power dividers and combiners, where minimal signal loss is paramount.

 

High Frequency DiClad 870 Copper Clad Laminate Sheet 0


Features & Benefits

  • Ultra-low loss tangent
  • Exceptional dimensional stability
  • Consistent product performance
  • Highly uniform electrical properties across the operating frequency range
  • Reliable, repeatable mechanical performance
  • Superior chemical resistance


Typical Applications

  • Military radar feed networks
  • Commercial phased array antenna networks
  • Low-loss base station antennas
  • Missile guidance systems
  • Digital radio antennas
  • RF filters, couplers, and low-noise amplifiers (LNAs)

 

Properties DiClad 870 Units Test Conditions Test Method
Electrical Properties - - - -
Dielectric Constant (10 GHz) 2.33 - 23˚C @ 50% RH 10 GHz IPC TM-650 [2.5.5.5](2.5.5.5)
Dielectric Constant (1 MHz) 2.33 - 23˚C @ 50% RH 1 MHz IPC TM-650 [2.5.5.3](2.5.5.3)
Dissipation Factor (10 GHz) 0.0013 - 23˚C @ 50% RH 10 GHz IPC TM-650 [2.5.5.5](2.5.5.5)
Dissipation Factor (1 MHz) 0.0009 - 23˚C @ 50% RH 1 MHz IPC TM-650 [2.5.5.3](2.5.5.3)
Thermal Coefficient of Dielectric Constant -161 ppm/˚C -10 to 140˚C 10 GHz IPC TM-650 [2.5.5.5](2.5.5.5)
Volume Resistivity 1.5 x 10⁹ MΩ-cm C96/35/90 IPC TM-650 [2.5.17.1](2.5.17.1)
Surface Resistivity 3.4 x 10⁷ C96/35/90 IPC TM-650 [2.5.17.1](2.5.17.1)
Dielectric Breakdown >45 kV D48/50 ASTM D-149
Arc Resistance >180 - - ASTM D-495
Thermal Properties - - - -
Coefficient of Thermal Expansion - x 17 ppm/˚C -50˚C to 150˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 29 ppm/˚C -50˚C to 150˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 217 ppm/˚C -50˚C to 150˚C IPC TM-650 2.4.24
Thermal Conductivity 0.26 W/(m.K) - ASTM E1461
Mechanical Properties - -

 

-

-
Copper Peel Strength 14 Lbs/in 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Young’s Modulus 485, 346 kpsi 23˚C @ 50% RH ASTM D-638
Tensile Strength (MD, CMD) 14.9, 11.2 kpsi 23˚C @ 50% RH ASTM D-882
Compressive Modulus 327 kpsi 23˚C @ 50% RH ASTM D-695
Flex Modulus 437 kpsi 23˚C @ 50% RH ASTM D-3039
Physical Properties - - - -
Flammability V-0 - C48/23/50 & C168/70 UL 94
Moisture Absorption 0.02 % E1/105+D24/23 IPC TM-650 [2.6.2.2](2.6.2.2)
Density 2.26 g/cm³ C24/23/50 Method A ASTM D792
NASA Outgassing - - - -
Total Mass Lost 0.02 % 125°C, ≤ 10⁻⁶ torr NASA SP-R-0022A
Collected Volatiles 0.00 % 125°C, ≤ 10⁻⁶ torr NASA SP-R-0022A
Water Vapor Recovered 0.01 % 125°C, ≤ 10⁻⁶ torr NASA SP-R-0022A

 

High Frequency DiClad 870 Copper Clad Laminate Sheet 1

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λεπτομέρειες για τα προϊόντα
High Frequency DiClad 870 Copper Clad Laminate Sheet
MOQ: 1 τεμ
τιμή: USD9.99-99.99
Τυπική συσκευασία: Σακούλες κενού + Χαρτοκιβώτια
Περίοδος παράδοσης: 8-9 εργάσιμες
Μέθοδος πληρωμής: T/T
Ικανότητα εφοδιασμού: 5000 τμχ το μήνα
Λεπτομέρειες
Τόπος καταγωγής
Κίνα
Μάρκα
Bicheng
Πιστοποίηση
UL, ISO9001, IATF16949
Αριθμό μοντέλου
BIC-332.V1.0
Αριθμός ανταλλακτικού:
Diclad 870
Πάχος laminate:
0,127mm 0,254mm 0,508mm 0,787mm 2,362mm 3,175mm
Μέγεθος laminate:
8” X 12” (203 X 305 mm)· 18” X 24” (475 X 610 mm)
Βάρος χαλκού:
0,5 OZ (0,018 mm), 1 OZ (0,035 mm)
Ποσότητα παραγγελίας min:
1 τεμ
Τιμή:
USD9.99-99.99
Συσκευασία λεπτομέρειες:
Σακούλες κενού + Χαρτοκιβώτια
Χρόνος παράδοσης:
8-9 εργάσιμες
Όροι πληρωμής:
T/T
Δυνατότητα προσφοράς:
5000 τμχ το μήνα
Επισημαίνω

High Frequency DiClad 870 laminate

,

Copper clad laminate sheet

,

DiClad 870 copper laminate

Περιγραφή προϊόντος

DiClad 870 laminates are woven fiberglass-reinforced PTFE composite materials formulated specifically for deployment as printed circuit board (PCB) substrates. Through precise regulation of the fiberglass-to-PTFE ratio, DiClad 870 laminates deliver a diversified product portfolio—spanning variants with ultra-low dielectric constant (Dk) and dissipation factor (Df), to highly reinforced grades optimized for enhanced dimensional stability.


The woven fiberglass reinforcement inherent to DiClad series materials confers superior dimensional stability compared to nonwoven fiberglass-reinforced PTFE laminates of equivalent dielectric constant. Rogers’ stringent consistency and process control over PTFE-coated fiberglass cloth not only enables a broader spectrum of available Dk values, but also yields laminates with improved dielectric constant uniformity relative to comparable nonwoven fiberglass-reinforced alternatives. The coated fiberglass plies within DiClad 870 materials are unidirectionally aligned; cross-plied configurations of most grades are offered under the CuClad product line.


DiClad 870 laminates are ideally suited for applications where dielectric constant uniformity is a critical performance criterion, including RF filters, couplers, and low-noise amplifiers (LNAs). They are also well-positioned for power dividers and combiners, where minimal signal loss is paramount.

 

High Frequency DiClad 870 Copper Clad Laminate Sheet 0


Features & Benefits

  • Ultra-low loss tangent
  • Exceptional dimensional stability
  • Consistent product performance
  • Highly uniform electrical properties across the operating frequency range
  • Reliable, repeatable mechanical performance
  • Superior chemical resistance


Typical Applications

  • Military radar feed networks
  • Commercial phased array antenna networks
  • Low-loss base station antennas
  • Missile guidance systems
  • Digital radio antennas
  • RF filters, couplers, and low-noise amplifiers (LNAs)

 

Properties DiClad 870 Units Test Conditions Test Method
Electrical Properties - - - -
Dielectric Constant (10 GHz) 2.33 - 23˚C @ 50% RH 10 GHz IPC TM-650 [2.5.5.5](2.5.5.5)
Dielectric Constant (1 MHz) 2.33 - 23˚C @ 50% RH 1 MHz IPC TM-650 [2.5.5.3](2.5.5.3)
Dissipation Factor (10 GHz) 0.0013 - 23˚C @ 50% RH 10 GHz IPC TM-650 [2.5.5.5](2.5.5.5)
Dissipation Factor (1 MHz) 0.0009 - 23˚C @ 50% RH 1 MHz IPC TM-650 [2.5.5.3](2.5.5.3)
Thermal Coefficient of Dielectric Constant -161 ppm/˚C -10 to 140˚C 10 GHz IPC TM-650 [2.5.5.5](2.5.5.5)
Volume Resistivity 1.5 x 10⁹ MΩ-cm C96/35/90 IPC TM-650 [2.5.17.1](2.5.17.1)
Surface Resistivity 3.4 x 10⁷ C96/35/90 IPC TM-650 [2.5.17.1](2.5.17.1)
Dielectric Breakdown >45 kV D48/50 ASTM D-149
Arc Resistance >180 - - ASTM D-495
Thermal Properties - - - -
Coefficient of Thermal Expansion - x 17 ppm/˚C -50˚C to 150˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 29 ppm/˚C -50˚C to 150˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 217 ppm/˚C -50˚C to 150˚C IPC TM-650 2.4.24
Thermal Conductivity 0.26 W/(m.K) - ASTM E1461
Mechanical Properties - -

 

-

-
Copper Peel Strength 14 Lbs/in 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Young’s Modulus 485, 346 kpsi 23˚C @ 50% RH ASTM D-638
Tensile Strength (MD, CMD) 14.9, 11.2 kpsi 23˚C @ 50% RH ASTM D-882
Compressive Modulus 327 kpsi 23˚C @ 50% RH ASTM D-695
Flex Modulus 437 kpsi 23˚C @ 50% RH ASTM D-3039
Physical Properties - - - -
Flammability V-0 - C48/23/50 & C168/70 UL 94
Moisture Absorption 0.02 % E1/105+D24/23 IPC TM-650 [2.6.2.2](2.6.2.2)
Density 2.26 g/cm³ C24/23/50 Method A ASTM D792
NASA Outgassing - - - -
Total Mass Lost 0.02 % 125°C, ≤ 10⁻⁶ torr NASA SP-R-0022A
Collected Volatiles 0.00 % 125°C, ≤ 10⁻⁶ torr NASA SP-R-0022A
Water Vapor Recovered 0.01 % 125°C, ≤ 10⁻⁶ torr NASA SP-R-0022A

 

High Frequency DiClad 870 Copper Clad Laminate Sheet 1

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