F4BM233 PCB Substrate Copper Clad Laminate Sheet

F4BM233 is a composite material engineered from fiberglass cloth, PTFE resin, and PTFE film through a precisely controlled scientific formulation and lamination process. It delivers enhanced electrical performance compared to standard F4B laminates, including a wider dielectric constant range, lower loss, higher insulation resistance, and greater operational stability, enabling it to serve as a direct substitute for comparable imported materials.

F4BM233 and F4BME233 share the same dielectric composition but are furnished with different copper foil options. F4BM233 is supplied with ED copper and is suitable for applications without passive intermodulation (PIM) requirements. F4BME233 features reverse-treated RTF foil, providing excellent PIM performance, improved etching accuracy for finer circuits, and reduced conductor loss.

The dielectric constant of F4BM233 is precisely tuned by adjusting the ratio of PTFE to fiberglass reinforcement. This achieves an optimal balance between low loss and enhanced dimensional stability. Higher dielectric constant grades incorporate a greater proportion of fiberglass, resulting in improved dimensional stability, lower coefficient of thermal expansion (CTE), better thermal drift performance, and a corresponding, controlled increase in dielectric loss.

Key Features

• Selectable dielectric constant (Dk) from 2.17 to 3.0; custom Dk available
• Low loss characteristics
• F4BME with RTF foil delivers excellent PIM performance
• Available in multiple sizes for panel optimization and cost efficiency
• Radiation resistant with low outgassing
• Commercially produced in volume for high availability and cost-effectiveness

Typical Applications

• Microwave, RF, and radar circuits
• Phase shifters and passive components
• Power dividers, couplers, and combiners
• Feed networks and phased array antennas
• Satellite communications and base station antennas