F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold
This double-sided PCB is engineered to meet the rigorous demands of high-reliability industries. It utilizes the advanced F4BTMS255 base material to deliver exceptional signal integrity, thermal stability, and mechanical durability. The board is compliant with IPC-Class-2 standards, undergoes 100% electrical testing prior to shipment, and is available for worldwide shipping.
Core Advantage: F4BTMS255 Aerospace-Grade Base Material
The F4BTMS255 is an upgraded flagship material, building on the F4BTM series with breakthroughs in formulation and manufacturing. It combines ultra-thin ultra-fine glass fiber cloth and uniformly distributed nano-ceramics with PTFE resin, minimizing glass fiber interference on electromagnetic waves while boosting key performance metrics. This makes it a direct replacement for premium foreign materials, ideal for aerospace and high-frequency applications.
Key Features of F4BTMS255
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Performance Indicator
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Specification
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Dielectric Constant (Dk)
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2.55 ± 0.04 at 10GHz (stable for high-frequency signals)
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Dissipation Factor
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0.0012 at 10GHz; 0.0013 at 20GHz (ultra-low loss for signal integrity)
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CTE (Coefficient of Thermal Expansion)
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X-axis: 15 ppm/°C; Y-axis: 20 ppm/°C; Z-axis: 80 ppm/°C (-55°C to 288°C)
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Thermal Coefficient of Dk
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-92 ppm/°C (-55°C to 150°C, ensures stable performance across temperatures)
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Flame Rating
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UL-94 V0 (enhanced safety for critical environments)
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Moisture Absorption
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0.025% (resists environmental degradation for long-term reliability)
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It also includes RTF low-roughness copper foil as standard (reduces conductor loss, improves peel strength) and is compatible with both copper and aluminum bases.
1. PCB Specifications
| Parameter |
Details & Benefits |
| Layer Count |
Double-sided (2-layer rigid PCB) – balances performance and design flexibility |
|
Board Dimensions
|
87mm x 80mm per piece (tolerance: ±0.15mm) – precise for consistent assembly |
| Minimum Trace/Space |
5/7 mils – supports dense circuitry for compact, high-density designs |
| Minimum Hole Size |
0.3mm (no blind vias) – simplifies assembly and reduces production complexity |
| Finished Board Thickness |
1.6mm – consistent thickness for reliable mounting and mechanical stability |
| Finished Copper Weight |
1oz (1.4 mils); 35μm per copper layer – ensures strong current carrying capacity |
| Via Plating Thickness |
20μm – guarantees robust electrical connectivity between layers |
| Surface Finish |
Immersion Gold – superior corrosion resistance, excellent solderability, and long-term reliability |
| Silkscreen |
Top: White; Bottom: None – clear component labeling (top side) without unnecessary bottom-side interference |
| Solder Mask |
Top: None; Bottom: None – ideal for applications requiring unobstructed signals (e.g., RF, microwave) |
| Quality Assurance |
100% Electrical Test prior to shipment – eliminates defects, ensures 100% functionality |
2. PCB Stack-up
| Layer Order |
Material |
Thickness |
| 1 |
Copper Layer 1 |
35μm |
| 2 |
F4BTMS255 Core |
1.524mm (60mil) |
| 3 |
Copper Layer 2 |
35μm |
3. Quality Compliance
Artwork Format: Gerber RS-274-X (industry-standard format for seamless manufacturing collaboration)
Quality Standard: IPC-Class-2 (meets strict criteria for commercial/industrial applications, ensuring consistent quality)
4. Typical Applications
This PCB is engineered for scenarios where performance and reliability are non-negotiable:
-Aerospace equipment (spacecraft, cabin systems)
-Microwave and RF devices
-Military/commercial radar systems
-Feed networks
-Phase-sensitive antennas (phased array antennas)
-Satellite communications systems
5. Global Availability
We offer worldwide shipping, ensuring timely delivery to support your projects—whether you operate in North America, Europe, Asia, or beyond.
Ready to Start Your Project?
If you need a high-performance PCB for aerospace, RF, or critical applications, contact us today for a custom quote or technical consultation.
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